Elpida, Powertech, and UMC announced the collaboration on 3D IC integration technologies for advanced manufacturing processes, according to a May 31, 2011 report by EE Times. It is reported that the collaboration concentrates on TSV (Through-Silicon Via) technology to set up a reliable approach to logic-plus-DRAM (Dynamic Random Access Memory). The collaboration among the three companies includes logic-to-DRAM interface design, TSV formation, wafer thinning, testing, and chip-stacking assembly. It is projected that the resulting technology will be able to cut costs, enhance logic yields, and accelerate 3D IC market entry.